The next wave of ultra sleek Ultrabook systems inspired by Intel are now available. Powered by 3rd Generation Intel Core processors, made with advanced 22nm 3-D tri-gate transistors, these new Ultrabook devices are responsive and more secure to better protect personal information. The new chips also offer increased media and graphics performance, long battery life and more choice in stylish designs.
This wave of Ultrabook devices brings Intel one step closer to delivering on the industry wide, multi-year endeavor to deliver a no-compromise, must-have computing experience.
Just about a month ago, Intel had introduced the quad-core 3rd Generation Intel Core processor family, delivering dramatic visual and performance computing gains for gamers, media enthusiasts and mainstream users alike.
Ultrabook devices will wake in a flash, meaning the system will transition from deep sleep (S4 mode) to its active state in less than 7 seconds. Additionally, all Ultrabook devices are now required to be “responsive while active” which means that they will load and run users’ favorite apps quickly.
Connecting at blazing speeds is also now possible with the addition of USB 3.0, Thunderbolt technology or both. Thunderbolt technology is a high-speed connection that allows incredibly fast transfers.
Security has become more important to protect users’ data, devices and personal assets. The next wave of Ultrabook systems is equipped with enhanced security features, including Intel Anti-Theft technology that lets people automatically disable the system if it is lost or stolen.. In India this service is currently being offered by Croma.
Because of Intel’s innovative 22nm tri-gate transistor manufacturing technology the 3rd GIntel Core processors now deliver 22% faster performance on multi-threaded applications compared to 2nd Generation Intel Core processors. For example, experiences when using photo editing software or many games will significantly improve based on the new processors.
Conceived by Intel just over a year ago, the Ultrabook category was quickly embraced by the industry. More than 20 systems have been introduced globally since October 2011, and today momentum is growing with more than 115 3rd Generation Intel Core processor-based Ultrabook devices under development.
Intel is working across a broad cross-section of the industry to accelerate and enable thin and light designs. A recent and significant breakthrough in chassis design using existing materials and standard injection molding equipment will enable an Ultrabook chassis that is equivalent in quality to machined aluminum and die-cast metal solutions in the market today. Borrowing engineering approaches from the automotive and aerospace industries, the new chassis design has the potential to reduce chassis costs by up to 65% and is expected to be in market next year.